Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764188 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin | 2023-09-19 |
| 11742296 | Electronic package and manufacturing method thereof | Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin +2 more | 2023-08-29 |
| 11610850 | Electronic package and fabrication method thereof | Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai | 2023-03-21 |