Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610850 | Electronic package and fabrication method thereof | Chih-Hsun Hsu, Chi-Jen Chen, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang | 2023-03-21 |
| 11600571 | Electronic package, packaging substrate, and methods for fabricating the same | Jun Ding, Hong-Da Chang | 2023-03-07 |