Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676877 | Electronic package with multiple electronic components spaced apart by grooves | Chun-Chang Ting, Chi-Jen Chen | 2023-06-13 |
| 11600571 | Electronic package, packaging substrate, and methods for fabricating the same | Jun Ding, Hsi-Chang Hsu | 2023-03-07 |