Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810862 | Electronic package and manufacturing method thereof | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2023-11-07 |
| 11792938 | Method for fabricating carrier structure | Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2023-10-17 |
| 11605554 | Flip-chip process and bonding equipment | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2023-03-14 |