Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810862 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Chang-Fu Lin | 2023-11-07 |
| 11605554 | Flip-chip process and bonding equipment | Yu-Lung Huang, Chih-Ming Huang, Chang-Fu Lin | 2023-03-14 |