Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705418 | Semiconductor package with conductive bump on conductive post including an intermetallic compound layer | Hyunsoo Chung, Taewon Yoo | 2023-07-18 |
| 11581234 | Semiconductor package with improved heat dissipation | Younglyong Kim, Aenee Jang | 2023-02-14 |