Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817443 | Semiconductor package including a first semiconductor chip with a plurality of first chip pads directly bonded to a plurality of second chip pads of an upper semiconductor chip | — | 2023-11-14 |
| 11676875 | Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon | Taewon Yoo | 2023-06-13 |
| 11581234 | Semiconductor package with improved heat dissipation | Myungkee Chung, Aenee Jang | 2023-02-14 |