Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705418 | Semiconductor package with conductive bump on conductive post including an intermetallic compound layer | Hyunsoo Chung, Myungkee Chung | 2023-07-18 |
| 11676875 | Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon | Younglyong Kim | 2023-06-13 |