Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705418 | Semiconductor package with conductive bump on conductive post including an intermetallic compound layer | Taewon Yoo, Myungkee Chung | 2023-07-18 |
| 11574819 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hansung Ryu, Inyoung Lee | 2023-02-07 |