Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810898 | Semiconductor package and method of manufacturing semiconductor package | — | 2023-11-07 |
| 11600601 | Semiconductor package | — | 2023-03-07 |
| 11594516 | Semiconductor package and method of manufacturing semiconductor package | — | 2023-02-28 |
| 11581234 | Semiconductor package with improved heat dissipation | Younglyong Kim, Myungkee Chung | 2023-02-14 |
| 11581248 | Semiconductor package | — | 2023-02-14 |