Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735689 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Sharon N. Farrens, Ali Sengül +1 more | 2023-08-22 |
| 11677051 | Application of underfill via centrifugal force | Daniel Brodoceanu, Tennyson Nguty, Chao Kai Tung, Oscar Torrents Abad | 2023-06-13 |
| 11579182 | Probe card for efficient screening of highly-scaled monolithic semiconductor devices | Daniel Brodoceanu, Christopher Percival, Chao Kai Tung | 2023-02-14 |
| 11575069 | Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Sharon Nanette Farrens, Ali Sengül | 2023-02-07 |
| 11563142 | Curing pre-applied and plasma-etched underfill via a laser | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Ali Sengül | 2023-01-24 |
| 11557692 | Selectively bonding light-emitting devices via a pulsed laser | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Sharon Nanette Farrens | 2023-01-17 |