Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735689 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon N. Farrens +1 more | 2023-08-22 |
| 11677051 | Application of underfill via centrifugal force | Daniel Brodoceanu, Zheng Sung Chio, Chao Kai Tung, Oscar Torrents Abad | 2023-06-13 |