Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756810 | Detection of force applied by pick-up tool for transferring semiconductor devices | Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi | 2023-09-12 |
| 11735689 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon N. Farrens +1 more | 2023-08-22 |
| 11670531 | Bridge pick-up head for transferring semiconductor devices | Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi | 2023-06-06 |
| 11575069 | Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens | 2023-02-07 |
| 11563142 | Curing pre-applied and plasma-etched underfill via a laser | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio | 2023-01-24 |