Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11575069 | Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Ali Sengül | 2023-02-07 |
| 11557692 | Selectively bonding light-emitting devices via a pulsed laser | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio | 2023-01-17 |