Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854886 | Methods of TSV formation for advanced packaging | Peng Suo, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2023-12-26 |
| 11837464 | Methods, systems, and apparatus for tape-frame substrate cleaning and drying | Guan Huei See, Gregory J. Wilson | 2023-12-05 |
| 11756925 | Methods and apparatus for vacuum processing a substrate | Ruiping Wang | 2023-09-12 |