Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Ralf Otremba, Chii Shang Hong, Jo Ean Joanna Chye, Teck Sim Lee, Hui Kin Lit +2 more | 2023-10-31 |
| 11600547 | Semiconductor package with expanded heat spreader | Jo Ean Joanna Chye, Teck Sim Lee, Ke Yan Tean | 2023-03-07 |