Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824015 | Structure and method for sealing a silicon IC | Sanjay Dabral, SivaChandra Jangam, Jun Zhai, Kunzhong Hu | 2023-11-21 |
| 11735567 | Wafer reconstitution and die-stitching | Sanjay Dabral, Jun Zhai, Kwan-Yu Lai, Kunzhong Hu | 2023-08-22 |
| 11699949 | Power management system switched capacitor voltage regulator with integrated passive device | Sanjay Dabral, David A. Secker, Jun Zhai, Ralf M. Schmitt, Wenjie Mao | 2023-07-11 |
| 11670548 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Jun Zhai, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2023-06-06 |