Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon | 2023-01-03 |
TK
Taegui Kim
Overall (2023): #236,105 of 537,848Top 45%
1
Patents 2023