Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848297 | Semiconductor device packages with high angle wire bonding and non-gold bond wires | Bo-Hsun Pan, Chien-Chang Li, Hung-Yu Chou, Byron Lovell Williams, Jeffrey Alan West +2 more | 2023-12-19 |
| 11614916 | User voice activity detection | Jiajin An, Michael Jon Wurtz, David Wurtz, Manpreet S. Khaira, Amit Kumar +3 more | 2023-03-28 |