Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837560 | Semiconductor device with waveguide and method therefor | Giorgio Carluccio, Maristella Spella, Scott M. Hayes | 2023-12-05 |
| 11823968 | Semiconductor device package having stress isolation and method therefor | Scott M. Hayes, Stephen R. Hooper | 2023-11-21 |
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Scott M. Hayes, Zhiwei Gong, Kabir Mirpuri, Rushik P. Tank, Betty Hill-Shan Yeung | 2023-11-14 |
| 11791283 | Semiconductor device packaging warpage control | Scott M. Hayes, Zhiwei Gong, Richard Te Gan, Vivek Gupta | 2023-10-17 |
| 11777204 | Package | Giorgio Carluccio, Maristella Spella, Antonius Johannes Matheus de Graauw, Harshitha Thippur Shivamurthy | 2023-10-03 |
| 11760623 | No-gel pressure sensor package | Stephen R. Hooper, Mark E. Schlarmann, Scott M. Hayes, Julien Juéry | 2023-09-19 |
| 11749624 | Semiconductor device and method | Abdellatif Zanati | 2023-09-05 |
| 11728285 | Semiconductor device packaging warpage control | Vivek Gupta, Scott M. Hayes, Richard Te Gan, Zhiwei Gong | 2023-08-15 |
| 11705410 | Semiconductor device having integrated antenna and method therefor | Vivek Gupta, Richard Te Gan, Kabir Mirpuri | 2023-07-18 |
| 11631625 | Topside heatsinking antenna launcher for an integrated circuit package | Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella | 2023-04-18 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2023-01-17 |
| 11557544 | Semiconductor device having a translation feature and method therefor | Giorgio Carluccio, Scott M. Hayes | 2023-01-17 |