Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Kabir Mirpuri, Betty Hill-Shan Yeung | 2023-11-14 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Kabir Mirpuri | 2023-01-17 |