Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837560 | Semiconductor device with waveguide and method therefor | Michael B. Vincent, Giorgio Carluccio, Maristella Spella | 2023-12-05 |
| 11823968 | Semiconductor device package having stress isolation and method therefor | Michael B. Vincent, Stephen R. Hooper | 2023-11-21 |
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Michael B. Vincent, Zhiwei Gong, Kabir Mirpuri, Rushik P. Tank, Betty Hill-Shan Yeung | 2023-11-14 |
| 11791283 | Semiconductor device packaging warpage control | Michael B. Vincent, Zhiwei Gong, Richard Te Gan, Vivek Gupta | 2023-10-17 |
| 11760623 | No-gel pressure sensor package | Stephen R. Hooper, Mark E. Schlarmann, Michael B. Vincent, Julien Juéry | 2023-09-19 |
| 11728285 | Semiconductor device packaging warpage control | Vivek Gupta, Michael B. Vincent, Richard Te Gan, Zhiwei Gong | 2023-08-15 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Zhiwei Gong, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2023-01-17 |
| 11557544 | Semiconductor device having a translation feature and method therefor | Michael B. Vincent, Giorgio Carluccio | 2023-01-17 |