Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823968 | Semiconductor device package having stress isolation and method therefor | Michael B. Vincent, Scott M. Hayes | 2023-11-21 |
| 11760623 | No-gel pressure sensor package | Mark E. Schlarmann, Michael B. Vincent, Scott M. Hayes, Julien Juéry | 2023-09-19 |