Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Rushik P. Tank, Betty Hill-Shan Yeung | 2023-11-14 |
| 11721642 | Semiconductor device package connector structure and method therefor | — | 2023-08-08 |
| 11705410 | Semiconductor device having integrated antenna and method therefor | Michael B. Vincent, Vivek Gupta, Richard Te Gan | 2023-07-18 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank | 2023-01-17 |