Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11714941 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang | 2023-08-01 |
| 11669472 | Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package | Lai Guan Tang, Ankireddy Nalamalpu, Dheeraj Subbareddy, Chee Hak Teh | 2023-06-06 |
| 11664317 | Reverse-bridge multi-die interconnect for integrated-circuit packages | Min Suet Lim, Eng Huat Goh | 2023-05-30 |
| 11658144 | Innovative interconnect design for package architecture to improve latency | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2023-05-23 |
| 11610856 | Connectivity between integrated circuit dice in a multi-chip package | Robert Sankman, Dheeraj Subbareddy, Ankireddy Nalamalpu | 2023-03-21 |
| 11595045 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler | 2023-02-28 |
| 11557541 | Interconnect architecture with silicon interposer and EMIB | Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan, Debendra Mallik +7 more | 2023-01-17 |