Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742330 | High connectivity device stacking | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2023-08-29 |
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Roman Gouk, Giback Park, Kyuil Cho, Tapash Chakraborty +2 more | 2023-07-18 |
| 11694912 | High pressure and high temperature anneal chamber | Jean Delmas, Steven Verhaverbeke | 2023-07-04 |
| 11676832 | Laser ablation system for package fabrication | Jeffrey L. Franklin, Wei-Sheng Lei, Steven Verhaverbeke, Jean Delmas, Han-Wen Chen +1 more | 2023-06-13 |