Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824012 | Integrated circuit package structure and method of manufacturing the same | Chia-Yu Peng, John Hon-Shing Lau | 2023-11-21 |
| 11764344 | Package structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo | 2023-09-19 |
| 11764120 | Chip packaging structure and manufacturing method thereof | Chia-Yu Peng, Pei-Chi Chen, Pu-Ju Lin, Cheng-Ta Ko | 2023-09-19 |
| 11710690 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chia-Yu Peng, Chi-Hai Kuo +1 more | 2023-07-25 |
| 11697594 | Method for recycling spent carbon cathode of aluminum electrolysis | Yanqing Lai, Zhongliang Tian, Yifan Li, Peiyu Gong, Bo Ki Hong +1 more | 2023-07-11 |
| 11682658 | Light-emitting package and method of manufacturing the same | Chen-Hao Lin, Chia-Hao Chang, Tzu-Nien LEE | 2023-06-20 |
| 11682612 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Chia-Yu Peng +1 more | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Chia-Yu Peng +2 more | 2023-05-30 |
| 11637047 | Manufacturing method of chip package structure | Pu-Ju Lin, Cheng-Ta Ko | 2023-04-25 |
| 11541493 | Multi-axis mechanism device | — | 2023-01-03 |