JH

Jun Chung Hsu

Apple: 1 patents #2,398 of 5,567Top 45%
📍 Cupertino, CA: #646 of 1,427 inventorsTop 50%
🗺 California: #26,301 of 67,585 inventorsTop 40%
Overall (2023): #379,779 of 537,848Top 75%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11545455 Semiconductor packaging substrate fine pitch metal bump and reinforcement structures Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim 2023-01-03