Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837680 | Substrate structuring methods | Han-Wen Chen, Steven Verhaverbeke | 2023-12-05 |
| 11742330 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Jeffrey L. Franklin +1 more | 2023-08-29 |
| 11715700 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more | 2023-08-01 |
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Kyuil Cho, Tapash Chakraborty +2 more | 2023-07-18 |
| 11676832 | Laser ablation system for package fabrication | Kurtis Leschkies, Jeffrey L. Franklin, Wei-Sheng Lei, Steven Verhaverbeke, Jean Delmas +1 more | 2023-06-13 |