Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837623 | Integrated circuit having vertical routing to bond pads | Christian Boemler, Justin Gordon Adams Wehner, Drew Fairbanks, Sean P. Kilcoyne | 2023-12-05 |
| 11791398 | Nano multilayer carbon-rich low-k spacer | Donald F. Canaperi, Richard A. Conti, Thomas J. Haigh, Jr., Son V. Nguyen | 2023-10-17 |
| 11753736 | Indium electroplating on physical vapor deposition tantalum | Michael J. Rondon, Jon Sigurdson | 2023-09-12 |
| 11710768 | Hybrid diffusion break with EUV gate patterning | Indira Seshadri, Andrew M. Greene, Julien Frougier, Veeraraghavan S. Basker | 2023-07-25 |
| 11710756 | Integrating optical elements with electro-optical sensors via direct-bond hybridization | Jamal I. Mustafa, Robert C. Anderson, John L. Vampola, Sean P. Kilcoyne, George Grama | 2023-07-25 |
| 11695059 | Bottom source/drain etch with fin-cut-last-VTFET | Tao Li, Indira Seshadri, Nelson Felix | 2023-07-04 |
| 11673766 | Elevator analytics facilitating passenger destination prediction and resource optimization | Gauri Karve, Tara Astigarraga, Kangguo Cheng, Fee Li Lie, Sean Teehan +1 more | 2023-06-13 |
| 11652161 | Nanosheet channel-to-source and drain isolation | Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, John R. Sporre, Sean Teehan | 2023-05-16 |
| 11646358 | Sacrificial fin for contact self-alignment | Yann Mignot, Indira Seshadri, Su Chen Fan, Christopher J. Waskiewicz | 2023-05-09 |
| 11646235 | Vertical tunneling field effect transistor with dual liner bottom spacer | Marc A. Bergendahl, Kangguo Cheng, Sean Teehan, John R. Sporre | 2023-05-09 |
| 11615992 | Substrate isolated VTFET devices | Marc A. Bergendahl, Kangguo Cheng, John R. Sporre, Gauri Karve, Fee Li Lie | 2023-03-28 |
| 11605717 | Wrapped-around contact for vertical field effect transistor top source-drain | Ruilong Xie, Jeffrey C. Shearer, Su Chen Fan, Heng Wu | 2023-03-14 |
| 11557589 | Air gap spacer for metal gates | Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, John R. Sporre, Sean Teehan | 2023-01-17 |