Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798865 | Nested architectures for enhanced heterogeneous integration | Ravindranath V. Mahajan, Debendra Mallik, Sujit Sharan | 2023-10-24 |
| 11749577 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Ravindranath V. Mahajan | 2023-09-05 |
| 11742261 | Nested architectures for enhanced heterogeneous integration | Ravindranath V. Mahajan, Debendra Mallik, Sujit Sharan | 2023-08-29 |
| 11742270 | Landing pad apparatus for through-silicon-vias | — | 2023-08-29 |
| 11594493 | Ceramic interposers for on-die interconnects | — | 2023-02-28 |
| 11587851 | Embedded bridge with through-silicon vias | Aditya S. Vaidya, Ravindranath V. Mahajan, Paul R. Start | 2023-02-21 |
| 11581235 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Ravindranath V. Mahajan | 2023-02-14 |
| 11569173 | Bridge hub tiling architecture | Andrew Collins, Wilfred Gomes, Ravindranath V. Mahajan, Sujit Sharan | 2023-01-31 |