Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581262 | Package comprising a die and die side redistribution layers (RDL) | Aniket PATIL, Hong Bok We, Yuzhe ZHANG | 2023-02-14 |
| 11552023 | Passive component embedded in an embedded trace substrate (ETS) | Kuiwon Kang, Marcus HSU, Terence Cheung | 2023-01-10 |