Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817369 | Lids for integrated circuit packages with solder thermal interface materials | Susmriti Das Mahapatra, Sergio Antonio Chan Arguedas, Peng Li, Amitesh Saha | 2023-11-14 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Kelly Lofgreen, Manish Dubey, Ken Hackenberg, Shenavia S. Howell +3 more | 2023-10-24 |
| 11670569 | Channeled lids for integrated circuit packages | Manish Dubey, Amitesh Saha, Marco Aurelio Cartas, Peng Li | 2023-06-06 |