Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784123 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Richard Vreeland, William Brezinski, Michael Christenson, Nafees Kabir | 2023-10-10 |
| 11594452 | Techniques for revealing a backside of an integrated circuit device, and associated configurations | Il-Seok Son, Paul B. Fischer, Patrick Morrow, Kimin Jun | 2023-02-28 |