Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784123 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Richard Vreeland, Colin T. Carver, Michael Christenson, Nafees Kabir | 2023-10-10 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784123 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Richard Vreeland, Colin T. Carver, Michael Christenson, Nafees Kabir | 2023-10-10 |