Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742295 | Interface of integrated circuit die and method for arranging interface thereof | Ting Wang, Ting-Chin Cho, Amnon Parnass, Chia-Hsiang Chang, Tsai-Ming Yang +13 more | 2023-08-29 |
| 11699683 | Semiconductor device in 3D stack with communication interface and managing method thereof | Amnon Parnass, Pei-Ling Yu, Li-Ken Yeh, Yung-Sheng Fang, Sheng-Wei Lin +3 more | 2023-07-11 |
| 11687472 | Interface for semiconductor device and interfacing method thereof | Amnon Parnass, Pei-Ling Yu, Li-Ken Yeh, Yung-Sheng Fang, Sheng-Wei Lin +3 more | 2023-06-27 |
| 11675731 | Data protection system and method thereof for 3D semiconductor device | Amnon Parnass, Pei-Ling Yu, Li-Ken Yeh, Yung-Sheng Fang, Sheng-Wei Lin +3 more | 2023-06-13 |
| 11600572 | Routing structure between dies and method for arranging routing between dies | Wei-Chieh Liao, Hao-Yu Tung, Yu-Cheng Sun, Ming-Hsuan WANG | 2023-03-07 |