Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600572 | Routing structure between dies and method for arranging routing between dies | Wei-Chieh Liao, Hao-Yu Tung, Yu-Cheng Sun, Igor Elkanovich | 2023-03-07 |
MW
Ming-Hsuan WANG
Global Unichip: 1 patents #15 of 44Top 35%
Overall (2023): #319,851 of 537,848Top 60%
1
Patents 2023