Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600572 | Routing structure between dies and method for arranging routing between dies | Wei-Chieh Liao, Yu-Cheng Sun, Ming-Hsuan WANG, Igor Elkanovich | 2023-03-07 |
HT
Hao-Yu Tung
Global Unichip: 1 patents #15 of 44Top 35%
Overall (2023): #428,984 of 537,848Top 80%
1
Patents 2023