YS

Yu-Cheng Sun

GU Global Unichip: 1 patents #15 of 44Top 35%
TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #187,066 of 537,848Top 35%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11600572 Routing structure between dies and method for arranging routing between dies Wei-Chieh Liao, Hao-Yu Tung, Ming-Hsuan WANG, Igor Elkanovich 2023-03-07