Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11850799 | Powdered surface monitoring system of additive manufacturing | Kuo-Kuang Jen, YI-CHERNG FERNG, Chun-Hsiang Huang, Yuan Lin, Chao-Kuei Lee +1 more | 2023-12-26 |
| 11742295 | Interface of integrated circuit die and method for arranging interface thereof | Ting Wang, Ting-Chin Cho, Igor Elkanovich, Amnon Parnass, Tsai-Ming Yang +13 more | 2023-08-29 |