| 11532539 |
Semiconductor package with wettable flank |
Hui Min LER, Soon Wei WANG |
2022-12-20 |
| 11508679 |
Polymer resin and compression mold chip scale package |
Yusheng LIN, Soon Wei WANG, Francis J. Carney |
2022-11-22 |
| 11482468 |
Power module package casing with protrusion supports |
Yushuang YAO, Vemmond Jeng Hung NG, Qing Yang |
2022-10-25 |
| 11469163 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2022-10-11 |
| 11462515 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2022-10-04 |
| 11452225 |
Fin frame assemblies |
Atapol Prajuckamol, Yushuang YAO |
2022-09-20 |
| 11437304 |
Substrate structures and methods of manufacture |
Yusheng LIN, Roger P. Stout, Sadamichi Takakusaki, Francis J. Carney |
2022-09-06 |
| 11404276 |
Semiconductor packages with thin die and related methods |
Francis J. Carney, Soon Wei WANG, Eiji KUROSE |
2022-08-02 |
| 11404277 |
Die sidewall coatings and related methods |
Francis J. Carney, Yusheng LIN, Michael J. Seddon, Soon Wei WANG, Eiji KUROSE |
2022-08-02 |
| 11374373 |
Press-fit pin for semiconductor packages and related methods |
Atapol Prajuckamol, Yusheng LIN |
2022-06-28 |
| 11373939 |
Quad leadframe packages and related methods |
Jinchang ZHOU, Asif Y. Jakwani, Yusheng LIN, Sravan VANAPARTHY, Silnore Tejero SABANDO |
2022-06-28 |
| 11361970 |
Silicon-on-insulator die support structures and related methods |
Michael J. Seddon, Francis J. Carney, Eiji KUROSE, Soon Wei WANG |
2022-06-14 |
| 11348878 |
Reinforced semiconductor die and related methods |
Erik Nino Tolentino, Yusheng LIN, Swee Har KHOR |
2022-05-31 |
| 11348796 |
Backmetal removal methods |
Michael J. Seddon, Francis J. Carney, Soon Wei WANG, Eiji KUROSE |
2022-05-31 |
| 11342237 |
Semiconductor package system and related methods |
Yushuang YAO, Atapol Prajuckamol |
2022-05-24 |
| 11342189 |
Semiconductor packages with die including cavities and related methods |
Michael J. Seddon, Francis J. Carney, Soon Wei WANG, Eiji KUROSE |
2022-05-24 |
| 11272625 |
Method for forming a semiconductor package |
Atapol Prajuckamol, Yushuang YAO |
2022-03-08 |
| 11217506 |
Semiconductor device assemblies including low-stress spacer |
Atapol Prajuckamol |
2022-01-04 |