Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404277 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG | 2022-08-02 |
| 11404276 | Semiconductor packages with thin die and related methods | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2022-08-02 |
| 11393692 | Semiconductor package electrical contact structures and related methods | Francis J. Carney, Michael J. Seddon, Yusheng LIN, Takashi Noma | 2022-07-19 |
| 11367619 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Francis J. Carney, Takashi Noma | 2022-06-21 |
| 11361970 | Silicon-on-insulator die support structures and related methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2022-06-14 |
| 11348796 | Backmetal removal methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2022-05-31 |
| 11342189 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2022-05-24 |
| 11328930 | Multi-faced molded semiconductor package and related methods | — | 2022-05-10 |
| 11244918 | Molded semiconductor package and related methods | Sw Wang, CH CHEW, How Kiat Liew | 2022-02-08 |