Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508579 | Backside metal photolithographic patterning die singulation systems and related methods | Michael J. Seddon | 2022-11-22 |
| 11393692 | Semiconductor package electrical contact structures and related methods | Francis J. Carney, Michael J. Seddon, Yusheng LIN, Eiji KUROSE | 2022-07-19 |
| 11387130 | Substrate alignment systems and related methods | Michael J. Seddon | 2022-07-12 |
| 11367619 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Francis J. Carney, Eiji KUROSE | 2022-06-21 |
| 11289381 | Methods of aligning a semiconductor wafer for singulation | Michael J. Seddon | 2022-03-29 |
| 11264264 | Solder bump formation using wafer with ring | Noboru Okubo, Yusheng LIN | 2022-03-01 |
| 11257759 | Isolation in a semiconductor device | Francis J. Carney, Yusheng LIN | 2022-02-22 |