Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508679 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Chee Hiong CHEW | 2022-11-22 |
| 11437304 | Substrate structures and methods of manufacture | Yusheng LIN, Roger P. Stout, Chee Hiong CHEW, Sadamichi Takakusaki | 2022-09-06 |
| 11437291 | Multichip module supports and related methods | Michael J. Seddon | 2022-09-06 |
| 11430746 | Multidie supports for reducing die warpage | Michael J. Seddon | 2022-08-30 |
| 11404276 | Semiconductor packages with thin die and related methods | Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-08-02 |
| 11404277 | Die sidewall coatings and related methods | Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-08-02 |
| 11393692 | Semiconductor package electrical contact structures and related methods | Michael J. Seddon, Yusheng LIN, Takashi Noma, Eiji KUROSE | 2022-07-19 |
| 11367619 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Takashi Noma, Eiji KUROSE | 2022-06-21 |
| 11361970 | Silicon-on-insulator die support structures and related methods | Michael J. Seddon, Eiji KUROSE, Chee Hiong CHEW, Soon Wei WANG | 2022-06-14 |
| 11348796 | Backmetal removal methods | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-05-31 |
| 11342189 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-05-24 |
| 11257759 | Isolation in a semiconductor device | Yusheng LIN, Takashi Noma | 2022-02-22 |