Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482468 | Power module package casing with protrusion supports | Vemmond Jeng Hung NG, Chee Hiong CHEW, Qing Yang | 2022-10-25 |
| 11452225 | Fin frame assemblies | Atapol Prajuckamol, Chee Hiong CHEW | 2022-09-20 |
| 11342237 | Semiconductor package system and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2022-05-24 |
| 11315859 | Power module | Qing Yang, Yong Liu | 2022-04-26 |
| 11272625 | Method for forming a semiconductor package | Atapol Prajuckamol, Chee Hiong CHEW | 2022-03-08 |