Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469163 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2022-10-11 |
| 11462515 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2022-10-04 |
| 11452225 | Fin frame assemblies | Chee Hiong CHEW, Yushuang YAO | 2022-09-20 |
| 11374373 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Yusheng LIN | 2022-06-28 |
| 11342237 | Semiconductor package system and related methods | Yushuang YAO, Chee Hiong CHEW | 2022-05-24 |
| 11272625 | Method for forming a semiconductor package | Chee Hiong CHEW, Yushuang YAO | 2022-03-08 |
| 11217506 | Semiconductor device assemblies including low-stress spacer | Chee Hiong CHEW | 2022-01-04 |