Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521928 | Reducing stress cracks in substrates | Yong Liu | 2022-12-06 |
| 11469163 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2022-10-11 |
| 11462515 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2022-10-04 |
| 11355341 | Semiconductor device and method for supporting ultra-thin semiconductor die | Gordon M. Grivna | 2022-06-07 |
| 11282764 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Roger M. Arbuthnot | 2022-03-22 |
| 11217515 | Semiconductor package structures and methods of manufacture | Jay A. Yoder, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya | 2022-01-04 |