Issued Patents 2022
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538708 | Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same | Shoichi Murakami, Shigeru NAKATSUKA, Syo Fukata, Yusuke OSAWA, Shigehiro Fujino | 2022-12-27 |
| 11508654 | Non-volatile memory with capacitors using metal under signal line or above a device capacitor | Luisa Lin, Mohan Dunga, Venkatesh Ramachandra, Peter Rabkin | 2022-11-22 |
| 11476272 | Three-dimensional memory device with a graphene channel and methods of making the same | Peter Rabkin | 2022-10-18 |
| 11444016 | Non-volatile memory with capacitors using metal under signal line or above a device capacitor | Luisa Lin, Mohan Dunga, Venkatesh Ramachandra, Peter Rabkin | 2022-09-13 |
| 11430745 | Semiconductor die containing silicon nitride stress compensating regions and method for making the same | Chen Wu, Peter Rabkin, Yangyin Chen | 2022-08-30 |
| 11424215 | Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners | Lin Hou, Peter Rabkin, Yangyin Chen | 2022-08-23 |
| 11387142 | Semiconductor device containing bit lines separated by air gaps and methods for forming the same | Koichi Matsuno, Johann Alsmeier | 2022-07-12 |
| 11362079 | Bonded die assembly containing a manganese-containing oxide bonding layer and methods for making the same | Chen Wu, Peter Rabkin | 2022-06-14 |
| 11355486 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Yuki Mizutani, James Kai | 2022-06-07 |
| 11348901 | Interfacial tilt-resistant bonded assembly and methods for forming the same | Lin Hou, Peter Rabkin, Yangyin Chen | 2022-05-31 |
| 11348649 | Threshold voltage setting with boosting read scheme | Kiyohiko Sakakibara, Hiroki Yabe, Ken Oowada | 2022-05-31 |
| 11335790 | Ferroelectric memory devices with dual dielectric confinement and methods of forming the same | Peter Rabkin | 2022-05-17 |
| 11276705 | Embedded bonded assembly and method for making the same | Chen Wu, Peter Rabkin, Yangyin Chen | 2022-03-15 |
| 11270963 | Bonding pads including interfacial electromigration barrier layers and methods of making the same | Chen Wu, Peter Rabkin | 2022-03-08 |
| 11239204 | Bonded assembly containing laterally bonded bonding pads and methods of forming the same | Chen Wu, Peter Rabkin, Yangyin Chen | 2022-02-01 |
| 11227663 | Boosting read scheme with back-gate bias | Kiyohiko Sakakibara, Ippei Yasuda, Ken Oowada | 2022-01-18 |