Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430745 | Semiconductor die containing silicon nitride stress compensating regions and method for making the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-08-30 |
| 11362079 | Bonded die assembly containing a manganese-containing oxide bonding layer and methods for making the same | Peter Rabkin, Masaaki Higashitani | 2022-06-14 |
| 11276705 | Embedded bonded assembly and method for making the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-03-15 |
| 11270963 | Bonding pads including interfacial electromigration barrier layers and methods of making the same | Peter Rabkin, Masaaki Higashitani | 2022-03-08 |
| 11239204 | Bonded assembly containing laterally bonded bonding pads and methods of forming the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-02-01 |