Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430745 | Semiconductor die containing silicon nitride stress compensating regions and method for making the same | Chen Wu, Peter Rabkin, Masaaki Higashitani | 2022-08-30 |
| 11424215 | Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners | Lin Hou, Peter Rabkin, Masaaki Higashitani | 2022-08-23 |
| 11348901 | Interfacial tilt-resistant bonded assembly and methods for forming the same | Lin Hou, Peter Rabkin, Masaaki Higashitani | 2022-05-31 |
| 11276705 | Embedded bonded assembly and method for making the same | Chen Wu, Peter Rabkin, Masaaki Higashitani | 2022-03-15 |
| 11239204 | Bonded assembly containing laterally bonded bonding pads and methods of forming the same | Chen Wu, Peter Rabkin, Masaaki Higashitani | 2022-02-01 |